Microwave substrate components
I. Overview
Using semiconductor thin film vacuum evaporation, sputtering, electroplating, photolithography, laser trimming, scribing and other processes, pattern metallization on the surface of ceramic substrates (or special substrates), while integrating resistors, capacitors, inductors, etc., to produce Circuit substrates with specific functions have functions such as electrical connection, physical support, and heat dissipation, and are used in hybrid integrated circuit microwave devices.
2. Product features
High frequency, high precision, high reliability
3. technical indicators
Material: Al2O3.
Accuracy: line width/line spacing accuracy ±2.5um.
Metalization: Ti, Ni, Pt, Au, TaN resistors, prefabricated AuSn films, etc.; meet the requirements of gold wire bonding, SnPb/AuSn/AuSi/AuGe welding, and conductive adhesive bonding.
Others: Wrap around on the side, through holes (through hole resistance is less than 50 milliohms).
Film system | Typical bottom resistance | 50 -75-100 Ω/□ |
Typical thickness of transition layer | 1000 ~3000Å | |
Surface metal thickness | 3~8μm | |
Photolithography | Resolution | 0.8μm |
Alignment accuracy | ±1μm | |
Double-sided exposure, thick glue exposure | ||
Dicing | Minimum cutting size | 0.5mm×0.5mm |
Dimensional accuracy | ±50μm | |
Unit alignment accuracy | ±5μm | |
Process capability | 2"× 2 |
[1mMikrodalga substrat bileşenleri
I. Genel Bakış
Yarı iletken ince film vakumlu buharlaştırma, püskürtme, galvanik kaplama, fotolitografi, lazer kırpma, kazıma ve diğer işlemler, seramik alt tabakaların (veya özel alt tabakaların) yüzeyinde desen metalizasyonu kullanarak, Devre alt tabakaları üretmek için dirençler, kapasitörler, indüktörler vb. elektriksel bağlantı, fiziksel destek ve ısı dağıtma gibi özel fonksiyonlara sahip olan ve hibrit entegre devre mikrodalga cihazlarında kullanılmaktadır.